FMVIP 2022 Nov. 18-20, 2022 | Chengdu, China

Committee

(All the committees are listed in alphabetical order)

General Chair

Jing Zhang, Sichuan University, China

Program Committee

Chee Kong Chui, National University of Singapore, Singapore (Chair)

Hao Ying, Wayne State University, USA

Organzing Committee Co-Chairs

Edmund Lai, Auckland University of Technology, New Zealand

Huiqi Li, Beijing Institute of Technology, China

Pengjiang Qian, Jiangnan University, China

Yiyu Cai, Nanyang Technological University, Singapore

Zheng Ma, Southwest Jiaotong University, China

Advisory Committee

David Li, University of Glasgow, UK

Publication Chair

Yizhang Jiang, Jiangnan University, China

Publicity Chair

Qi Zeng, Sichuan University, China

Max Chen, Asia-Pacific Institute of Science and Engineering, Hong Kong S. A. R., China

Financial Chair

Xueqin Jiang, Donghua University, China

Local Committee

Deqing Huang, Southwest Jiaotong University, China

Ling He, Sichuan University, China

Yury Yu, Asia-Pacific Institute of Science and Engineering, Hong Kong S. A. R., China

International Technical Committee

Anand Nayyar, Duy Tan University, Vietnam

Adarsh Kumar, University of Petroleum and Energy Studies, Dehradun, India

Adnan Aldemir, Van Yüzüncü Yıl University, Turkey

Anusha Achuthan, Universiti Sains Malaysia, Malaysia

Abdel-Badeeh M. Salem, Ain Shams University, Egypt

Chee Kiat Seow, University of Glasgow, UK

Cong Pu, Marshall University, USA

Changsoo Je, Sogang University, South Korea

Elżbieta Macioszek, Silesian University of Technology, Poland

Fei Yuan, Ryerson University, Canada

Francesco Zirilli, Sapienza Universita Roma, Italy

Gordana Jovanovic Dolecek, Institute National INAOE, Mexico

Grigorios N. Beligiannis, University of Patras – Agrinio Campus,Greece

Hideyuki Takahashi, Tohoku Gakuin University, Japan

Haw Su Cheng, Multimedia University, Malaysia

Iouliia Skliarova, University of Aveiro, Portugal

Ishak b. Aris, Universiti Putra Malaysia, Malaysia

Junsheng Zhang, Institute of Scientific and Technical Information of China, China

José Manuel Molina López, Universidad Carlos III de Madrid, Spain

Kasturi Vasudevan, Indian Institute of Technology Kanpur, India

Kamran Iqbal, University of Arkansas at Little Rock, USA

Ljiljana Trajkovic, Simon Fraser University, Canada

Luis Gómez, Universidad de Las Palmas de Gran Canaria, Spain

Liming Zhang, University of Macau, China

Mukesh Singh Boori, Samara National Research University, Russia

Maoshen Jia, Beijing University of Technology, China

Malik Zawwar Hussain, University of the Punjab, Pakistan

Mudasser Wyne, Kearny Mesa Campus, USA

Nizar Bouguila, Concordia University, Canada

Niranjana S., Manipal Institute of Technology (MIT), India

Olarik Surinta, Mahasarakham University, Thailand

Paul Stynes, National College of Ireland, Ireland

Paulo Gil, University of Coimbra, Portugal

Qi Cao, University of Glasgow, UK

Qun Wan, University of Electronic Science and Technology of China, China

RajaniKanth Aluvalu, Vardhaman College of Engineering Hyderabad, India

Ruksar Fatima, KBN College of Engineering, India

Rachna Jain, Bharati Vidyapeeth's College of Engineering, India

Stefano Berretti, University of Florence, Italy

S. Gandhiya Vendhan, Bharathiar University, India

Smain Femmam, UHA University, France

Smain Femmam, UHA University, France

Takfarinas Saber, Dublin City University, Ireland

Tiehua Du, Nanyang polytechnic, Singapore

Thumrongrat Amornraksa, King Mongkut's University of Technology Thonburi, Thailand

Uma Maheswari V, Vardhman College of Engineering, Hyderabad, India

Yongqiang Zhao, Northwestern Polytechnical University, China

Zainal Rasyid Mahayuddin, University Kebangsaan Malaysia, Malaysia

Zoltán Ernő Csajbók, University of Debrecen, Hungary